Flexible Electronics News

3D-Shaped Automotive Center Panel Shown at Embedded World 2018 Conference

The demonstrator has been done as a joint project between Canatu, Cypress Semiconductor Corp. and NISSHA Corporation.

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By: Anthony Locicero

Copy editor, New York Post

Canatu, Cypress Semiconductor Corp and NISSHA Corporation jointly demonstrated a truly 3D shaped automotive center panel at Embedded World 2018 in Germany. The demonstrator at the Cypress Semiconductors Corp’s booth showed how a 3D shaped center panel can fit to a sleek interior, being discretely black until lit. Thus, the interior can be planned from the design point of view without limitations. When the functions are needed, the driver finds them easily blindly with the help of intuitive...

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